SI2351DS [VISHAY]

P-Channel 20-V (D-S) MOSFET; P通道20 -V (D -S )的MOSFET
SI2351DS
型号: SI2351DS
厂家: VISHAY    VISHAY
描述:

P-Channel 20-V (D-S) MOSFET
P通道20 -V (D -S )的MOSFET

文件: 总7页 (文件大小:125K)
中文:  中文翻译
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Si2351DS  
Vishay Siliconix  
P-Channel 20-V (D-S) MOSFET  
FEATURES  
MOSFET PRODUCT SUMMARY  
Halogen-free Option Available  
TrenchFET® Power MOSFET  
PWM Optimized  
D (A)a  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
I
0.115 at VGS = - 4.5 V  
0.205 at VGS = - 2.5 V  
- 3.0  
RoHS  
- 20  
3.2 nC  
COMPLIANT  
100 % Rg Tested  
- 2.2  
TO-236  
(SOT-23)  
G
S
1
2
3
D
Top View  
Si2351DS (G1)*  
* Marking Code  
Ordering Information: Si2351DS-T1-E3 (Lead (Pb)-free)  
Si2351DS-T1-GE3 (Lead (Pb)-free and Halogen-free)  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
Unit  
VDS  
VGS  
- 20  
12  
Drain-Source Voltage  
Gate-Source Voltage  
V
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
- 2.8  
- 2.4  
- 2.2b, c  
- 1.8b, c  
- 10  
Continuous Drain Current (TJ = 150 °C)  
ID  
A
IDM  
IS  
Pulsed Drain Current  
TC = 25 °C  
TA = 25 °C  
- 2.0  
- 0.91b, c  
2.1  
Continuous Source-Drain Diode Current  
T
C = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
1.5  
PD  
Maximum Power Dissipation  
W
1.0b, c  
0.7b, c  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
- 55 to 150  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Typical  
90  
Maximum  
Symbol  
RthJA  
Unit  
Maximum Junction-to-Ambientb, d  
Maximum Junction-to-Foot (Drain)  
5 s  
Steady State  
115  
75  
°C/W  
RthJF  
60  
Notes:  
a. Based on TC = 25 °C.  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 5 s.  
d. Maximum under Steady State conditions is 130 °C/W.  
Document Number: 73702  
S-80642-Rev. C, 24-Mar-08  
www.vishay.com  
1
Si2351DS  
Vishay Siliconix  
MOSFET SPECIFICATIONS T = 25 °C, unless otherwise noted  
J
Parameter  
Symbol  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Static  
VDS  
VDS = 0 V, ID = - 250 µA  
Drain-Source Breakdown Voltage  
- 20  
V
V
DS Temperature Coefficient  
ΔVDS/TJ  
- 16.7  
2.1  
mV/°C  
ID = - 250 µA  
VGS(th) Temperature Coefficient  
Δ
V
/T  
GS(th) J  
VGS(th)  
IGSS  
VDS = VGS, ID = - 250 µA  
Gate-Source Threshold Voltage  
Gate-Source Leakage  
- 0.6  
- 10  
- 1.5  
100  
- 1  
V
VDS = 0 V, VGS  
=
12 V  
nA  
VDS = - 20 V, VGS = 0 V  
DS = - 20 V, VGS = 0 V, TJ = 55 °C  
VDS - 5 V, VGS = - 4.5 V  
VGS = - 4.5 V, ID = - 2.4 A  
IDSS  
ID(on)  
RDS(on)  
gfs  
Zero Gate Voltage Drain Current  
On-State Drain Currenta  
µA  
A
V
- 10  
0.092  
0.164  
5.5  
0.115  
0.205  
Drain-Source On-State Resistancea  
Forward Transconductancea  
Ω
S
VGS = - 2.5 V, ID = - 1.8 A  
VDS = - 10 V, ID = - 2.4 A  
Dynamicb  
Ciss  
Coss  
Crss  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
250  
80  
V
DS = - 10 V, VGS = 0 V, f = 1 MHz  
pF  
55  
V
DS = - 10 V, VGS = - 5.0 V, ID = - 2.4 A  
3.4  
3.2  
0.5  
1.4  
8.5  
9
5.1  
5
Qg  
Total Gate Charge  
nC  
Ω
Qgs  
Qgd  
Rg  
Gate-Source Charge  
Gate-Drain Charge  
VDS = - 10 V, VGS = - 4.5 V, ID = - 2.4 A  
f = 1 MHz  
Gate Resistance  
13  
14  
45  
48  
24  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
Rise Time  
30  
VDD = - 10 V, RL = 5.26 Ω  
ns  
ID - 1.9 A, VGEN = - 4.5 V, RG = 1 Ω  
Turn-Off Delay Time  
32  
Fall Time  
16  
Drain-Source Body Diode Characteristics  
Continuous Source-Drain Diode Current  
IS  
ISM  
VSD  
trr  
TC = 25 °C  
IS = - 2.0 A  
- 2.0  
- 10  
- 1.2  
26  
A
Pulse Diode Forward Currenta  
Body Diode Voltage  
- 0.8  
17  
5
V
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
Reverse Recovery Fall Time  
Reverse Recovery Rise Time  
ns  
nC  
Qrr  
ta  
8
IF = - 2.0 A, di/dt = 100 A/µs, TJ = 25 °C  
14  
3
ns  
tb  
Notes:  
a. Pulse test; pulse width 300 µs, duty cycle 2 %.  
b. Guaranteed by design, not subject to production testing.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
www.vishay.com  
2
Document Number: 73702  
S-80642-Rev. C, 24-Mar-08  
Si2351DS  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
10  
5
4
3
2
1
0
V
GS  
= 5 thru 3 V  
8
6
4
2
0
V
GS  
= 2.5 V  
V
GS  
= 2 V  
T
C
= 25 °C  
T
C
= 125 °C  
V
= 1.5 V  
GS  
T
C
= - 55 °C  
2.0  
0
1
2
3
4
0.0  
0.5  
1.0  
1.5  
2.5  
V
DS  
- Drain-to-Source Voltage (V)  
V
GS  
- Gate-to-Source Voltage (V)  
Output Characteristics  
Transfer Characteristics  
0.30  
0.25  
0.20  
0.15  
0.10  
0.05  
0.00  
500  
400  
300  
200  
100  
0
V
GS  
= 2.5 V  
C
iss  
V
GS  
= 4.5 V  
C
oss  
C
rss  
0
2
4
6
8
10  
0
4
8
12  
16  
20  
I
D
- Drain Current (A)  
V
DS  
- Drain-to-Source Voltage (V)  
On-Resistance vs. Drain Current and Gate Voltage  
Capacitance  
5
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
I
D
= 3.0 A  
V = 4.5 V, I = 2.4 A  
GS D  
4
3
2
1
0
V
DS  
= 10 V  
V
GS  
= 2.5 V, I = 1.8 A  
D
V
DS  
= 16 V  
0
1
2
3
4
- 50 - 25  
0
25  
50  
75  
100 125 150  
Q
g
- Total Gate Charge (nC)  
T - Junction Temperature (°C)  
J
Gate Charge  
On-Resistance vs. Junction Temperature  
Document Number: 73702  
S-80642-Rev. C, 24-Mar-08  
www.vishay.com  
3
Si2351DS  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
0.36  
0.28  
0.20  
0.12  
0.04  
10  
I
D
= 2.4 A  
T
A
= 150 °C  
T
A
= 25 °C  
1
T
= 125 °C  
A
T
A
= 25 °C  
4
0.1  
0.00  
1
2
3
5
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
V
GS  
- Gate-to-Source Voltage (V)  
V
SD  
- Source-to-Drain Voltage (V)  
On-Resistance vs. Gate-to-Source Voltage  
Source-Drain Diode Forward Voltage  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
10  
8
T
= 25 °C  
A
6
4
2
0
Single Pulse  
I
D
= 250 µA  
- 50 - 25  
0
25  
50  
75  
100 125 150  
0.01  
0.1  
1
10  
100  
600  
T
- Temperature (°C)  
Time (s)  
Single Pulse Power  
J
Threshold Voltage  
100  
Limited by R  
DS(on)*  
10  
10 ms  
1
100 ms  
1 s  
10 s  
0.1  
DC  
T
A
= 25 °C  
Single Pulse  
0.01  
0.001  
0.1  
1
10  
100  
V
DS  
- Drain-to-Source Voltage (V)  
* V  
GS  
minimum V at which R  
is specified  
DS(on)  
GS  
Safe Operating Area  
www.vishay.com  
4
Document Number: 73702  
S-80642-Rev. C, 24-Mar-08  
Si2351DS  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
4
2.4  
1.8  
1.2  
0.6  
0.0  
3
2
1
0
0
25  
50  
75  
100  
125  
150  
0
25  
50  
T - Case Temperature (°C)  
C
75  
100  
125  
150  
T
C
- Case Temperature (°C)  
Current Derating*  
Power Derating, Junction-to-Foot  
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper  
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package  
limit.  
Document Number: 73702  
S-80642-Rev. C, 24-Mar-08  
www.vishay.com  
5
Si2351DS  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
Notes:  
P
DM  
0.1  
0.05  
t
1
t
2
0.02  
t
t
1
1. Duty Cycle, D =  
2
2. Per Unit Base = R  
= 130 °C/W  
thJA  
(t)  
3. T - T = P  
Z
JM DM thJA  
A
Single Pulse  
4. Surface Mounted  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
10  
100  
600  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single Pulse  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
10  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Foot  
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon  
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and  
reliability data, see http://www.vishay.com/ppg?73702  
www.vishay.com  
6
Document Number: 73702  
S-80642-Rev. C, 24-Mar-08  
Legal Disclaimer Notice  
Vishay  
Disclaimer  
All product specifications and data are subject to change without notice.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf  
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein  
or in any other disclosure relating to any product.  
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any  
information provided herein to the maximum extent permitted by law. The product specifications do not expand or  
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed  
therein, which apply to these products.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this  
document or by any conduct of Vishay.  
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless  
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such  
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting  
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding  
products designed for such applications.  
Product names and markings noted herein may be trademarks of their respective owners.  
Document Number: 91000  
Revision: 18-Jul-08  
www.vishay.com  
1

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