SMG2310 [SECOS]

N-Channel Enhancement Mode Power Mos.FET; N沟道增强模式电源Mos.FET
SMG2310
型号: SMG2310
厂家: SECOS HALBLEITERTECHNOLOGIE GMBH    SECOS HALBLEITERTECHNOLOGIE GMBH
描述:

N-Channel Enhancement Mode Power Mos.FET
N沟道增强模式电源Mos.FET

文件: 总4页 (文件大小:253K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SMG2310  
3A, 60V,RDS(ON) 90m  
Ω
Elektronische Bauelemente  
N-Channel Enhancement Mode Power Mos.FET  
RoHS Compliant Product  
Description  
SC-59  
Min  
A
Dim  
A
Max  
3.10  
1.60  
1.30  
0.50  
2.10  
0.10  
0.26  
0.60  
1.15  
2.80  
The SMG2310 utilized advanced processing techniques  
to achieve the lowest possible on-resistance, extremely  
efficient and cost-effectiveness device.  
L
2.70  
1.40  
1.00  
0.35  
1.70  
0.00  
0.10  
0.20  
0.85  
2.40  
3
B
S
B
Top View  
The SC-59 package is universally used for all  
2
1
C
commercial-industrial applications  
D
D
G
H
G
Features  
J
J
C
K
* Simple drive requirement  
* Small package outline  
K
H
L
Drain  
S
Gate  
All Dimension in mm  
Applications  
D
Source  
* Power management in Notebook Computer  
* Portable equipment  
* Battery powered system  
G
Marking : 2310  
S
Absolute Maximum Ratings  
Parameter  
Drain-Source Voltage  
Symbol  
VDS  
Ratings  
Unit  
V
60  
±20  
3.0  
2.3  
10  
Gate-Source Voltage  
VGS  
V
3
ID@TA=25oC  
Continuous Drain Current, VGS@4.5V  
A
3
oC  
Continuous Drain Current, VGS@4.5V  
ID@TA=70  
A
A
Pulsed Drain Current1,2  
IDM  
Total Power Dissipation  
PD@TA=25o  
C
1.38  
0.01  
W
W/oC  
Linear Derating Factor  
oC  
-55~+150  
Tj, Tstg  
Operating Junction and Storage Temperature Range  
Thermal Data  
Parameter  
Symbol  
Ratings  
Unit  
oC /W  
Thermal Resistance Junction-ambient3  
Rthj-a  
90  
http://www.SeCoSGmbH.com/  
Any changing of specification will not be informed individual  
01-Jun-2002 Rev. A  
Page 1 of 4  
SMG2310  
Ω
3A, 60V,RDS(ON) 90m  
Elektronische Bauelemente  
N-Channel Enhancement Mode Power Mos.FET  
Electrical Characteristics( Tj=25oC Unless otherwise specified)  
Parameter  
Symbol  
Max.  
Min.  
Typ.  
Unit  
V
Test Condition  
_
_
VGS=0V, ID=250uA  
60  
_
BVDSS  
Drain-Source Breakdown Voltage  
Breakdown Voltage Temp. Coefficient  
Gate Threshold Voltage  
Reference to 25oC,ID=1mA  
VDS=VGS, ID=250uA  
V/oC  
V
_
0.05  
_
BVDS/ Tj  
VGS(th)  
1.0  
_
3.0  
_
_
±
100  
±
VGS= 20V  
nA  
uA  
uA  
IGSS  
IDSS  
Gate-Source Leakage Current  
Drain-Source Leakage Current (Tj=25o )  
C
_
VDS=60V,VGS=0  
VDS=48V,VGS=0  
10  
25  
Drain-Source Leakage Current (Tj=70o )  
C
_
_
_
_
_
VGS=10V, ID=3A  
90  
Static Drain-Source On-Resistance2  
mΩ  
RDS(ON)  
_
_
VGS=4.5V, ID=2.0A  
120  
Total Gate Charge2  
Qg  
6
1.6  
3
10  
_
ID=3A  
_
_
VDS=48V  
VGS=4.5V  
nC  
Gate-Source Charge  
Qgs  
_
_
Gate-Drain ("Miller") Charge  
Qgd  
Turn-on Delay Time2  
Rise Time  
_
_
Td(ON)  
6
VDD=30V  
ID=1A  
_
_
_
5
Tr  
VGS=10V  
nS  
_
Ω
RG=3.3  
Td(Off)  
Turn-off Delay Time  
Fall Time  
16  
3
Ω
RD=30  
_
_
_
_
T
f
780  
_
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
490  
55  
40  
5.0  
Ciss  
Coss  
Crss  
VGS=0V  
VDS=25V  
f=1.0MHz  
pF  
S
_
_
_
VDS=5V, ID=3A  
Forward Transconductance  
Gfs  
Source-Drain Diode  
Parameter  
Symbol  
Max.  
Min.  
Typ.  
Unit  
Test Condition  
_
_
Forward On Voltage2  
1.2  
_
V
VSD  
IS=1.2A, VGS=0V.  
_
Reverse Recovery Time  
Reverse Recovery Charge  
nS  
nC  
Trr  
25  
26  
Is=3A,VGS=0V  
dl/dt=100A/uS  
_
_
Qrr  
Notes: 1.Pulse width limited by Max. junction temperature.  
2.Pulse width 300us, dutycycle 2%.  
3.Surface mounted on 1 inch2 copper pad of FR4 board; 270°C/W when mounted on min. copper pad.  
http://www.SeCoSGmbH.com/  
Any changing of specification will not be informed individual  
01-Jun-2002 Rev. A  
Page 2 of 4  
SMG2310  
3A, 60V,RDS(ON) 90m  
Ω
Elektronische Bauelemente  
Characteristics Curve  
N-Channel Enhancement Mode Power Mos.FET  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
Fig 4. Normalized On-Resistance  
v.s. Junction Temperature  
Fig 3. On-Resistance v.s. Gate Voltage  
Fig 6. Gate Threshold Voltage v.s.  
Fig 5. Forward Characteristics of  
Reverse Diode  
Junction Temperature  
http://www.SeCoSGmbH.com/  
Any changing of specification will not be informed individual  
01-Jun-2002 Rev. A  
Page 3 of 4  
SMG2310  
Ω
3A, 60V,RDS(ON) 90m  
Elektronische Bauelemente  
N-Channel Enhancement Mode Power Mos.FET  
Fig 7. Gate Charge Characteristics  
Fig 8. Typical Capacitance Characteristics  
Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance  
Fig 11. Switching Time Waveform  
Fig 12. Gate Charge Waveform  
http://www.SeCoSGmbH.com/  
Any changing of specification will not be informed individual  
01-Jun-2002 Rev. A  
Page 4 of 4  

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