STPS1H100AY [STMICROELECTRONICS]
Automotive high voltage power Schottky rectifier; 汽车高电压功率肖特基整流器
| 型号： | STPS1H100AY |
| 厂家： | 
ST |
| 描述： | Automotive high voltage power Schottky rectifier |
| 文件： | 总9页 (文件大小：136K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STPS1H100-Y
Automotive high voltage power Schottky rectifier
Features
■ Negligible switching losses
A
A
■ High junction temperature capability
■ Low leakage current
K
K
■ Good trade-off between leakage current and
forward voltage drop
SMA
SMB
(JEDEC DO-214AC)
STPS1H100AY
(JEDEC DO-214AA)
STPS1H100UY
■ Avalanche capability specified
®
■ ECOPACK 2 compliant component
■ AEC-Q101 qualified
Table 1.
Device summary
Description
Symbol
Value
Schottky rectifiers packaged in SMA or SMB, and
designed for high frequency miniature switched
mode power supplies as DC/DC converters for
automotive applications.
IF(AV)
VRRM
1 A
100 V
175 °C
0.62 V
Tj (max)
VF(max)
December 2010
Doc ID 17935 Rev 1
1/9
www.st.com
9
Characteristics
STPS1H100-Y
1
Characteristics
Table 2.
Symbol
Absolute ratings (limiting values)
Parameter
Value
Unit
VRRM Repetitive peak reverse voltage
100
V
A
IF(RMS) Forward rms voltage
IF(AV) Average forward current
10
TL = 160 °C δ = 0.5
1
A
IFSM
IRRM
IRSM
Surge non repetitive forward current tp =10 ms sinusoidal
Repetitive peak reverse current tp = 2 µs F = 1 kHz square
Non repetitive peak reverse current tp = 100 µs square
50
A
1
1
A
A
PARM Repetitive peak avalanche power
tp = 1 µs Tj = 25 °C
1500
W
°C
°C
V/µs
Tstg
Tj
Storage temperature range
- 65 to + 175
- 40 to + 175
10000
Operating junction temperature (1)
dV/dt Critical rate of rise of reverse voltage
1
dPtot
dTj
<
1.
condition to avoid thermal runaway for a diode on its own heatsink
Rth(j-a)
Table 3.
Symbol
Thermal resistance
Parameter
Value
Unit
SMA
SMB
30
25
Rth(j-l) Junction to lead
°C/W
Table 4.
Symbol
Static electrical characteristics
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
4
µA
(1)
IR
Reverse leakage current
VR = VRRM
0.2
0.5
mA
0.77
0.62
0.86
0.7
IF = 1 A
0.58
0.65
(2)
VF
Forward voltage drop
V
IF = 2 A
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
2
P = 0.54 x I
+ 0.08 I
F(AV)
F (RMS)
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STPS1H100-Y
Characteristics
Figure 1.
Average forward power dissipation Figure 2.
versus average forward current
Average forward current versus
ambient temperature (δ = 0.5)
I
(A)
F(AV)
P
(W)
F(AV)
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
δ = 0.5
Rth(j-a)=Rth(j-l)
δ = 0.2
δ = 0.1
δ = 0.05
Rth(j-a)=120°C/W
Rth(j-a)=100°C/W
SMB
δ = 1
SMA
Rth(j-a)=200°C/W
T
T
I
(A)
F(AV)
tp
=tp/T
1.0
T
(°C)
amb
tp
δ
=tp/T
δ
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.1
1.2
0
25
50
75
100
125
150
175
Figure 3.
Normalized avalanche power
derating versus pulse duration
Figure 4.
Normalized avalanche power
derating versus junction
temperature
PARM(Tj)
PARM(t )
p
PARM(25 °C)
PARM(1µs)
1.2
1
1
0.1
0.8
0.6
0.4
0.2
0
0.01
Tj(°C)
tp(µs)
1000
0.001
0.01
0.1
1
10
100
150
25
50
75
100
125
Figure 5.
Non repetitive surge peak forward Figure 6.
current versus overload duration
(maximum values) (SMB)
Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMA)
I
M
(A)
I
M
(A)
8
7
6
5
4
3
2
1
0
10
9
8
7
6
5
4
3
2
1
0
SMA
SMB
Ta=25 °C
Ta=25 °C
Ta=75 °C
Ta=75 °C
Ta=110 °C
Ta=110 °C
IM
IM
t(s)
t
t
t(s)
δ =0.5
δ =0.5
1.E-03
1.E-02
1.E-01
1.E+00
1.E-03
1.E-02
1.E-01
1.E+00
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Characteristics
STPS1H100-Y
Figure 7.
Relative variation of thermal
Figure 8.
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMB)
impedance junction to ambient
versus pulse duration (SMA)
Z
/R
Z
/R
th(j-c) th(j-c)
th(j-c) th(j-c)
1.00
0.10
0.01
1.00
0.10
0.01
SMB
SMA
Single pulse
Single pulse
t (s)
p
t (s)
p
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 9.
Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 10. Junction capacitance versus
reverse voltage applied
(typical values)
I (µA)
R
C(pF)
1.E+03
100
F=1 MHz
V
OSC=30 mVRMS
Tj=25 °C
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
1.E-03
Tj=125 °C
Tj=25 °C
V (V)
R
V
(V)
R
10
1
10
100
0
10
20
30
40
50
60
70
80
90
100
Figure 11. Forward voltage drop versus
forward current (maximum values)
Figure 12. Thermal resistance junction to
ambient versus copper surface
under each lead (SMB)
R
(°C/W)
th(j-a)
I (A)
FM
120
110
100
90
100.00
10.00
1.00
Epoxy printed circuit board FR4, copper thickness: 35 µm
SMB
80
Tj=125 °C
Tj=25 °C
70
60
50
0.10
40
S(Cu)(cm²)
30
V
(V)
FM
0.01
20
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
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Doc ID 17935 Rev 1
STPS1H100-Y
Characteristics
Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (SMA)
R (°C/W)
th(j-a)
140
130
120
110
100
90
Epoxy printed circuit board FR4, copper thickness: 35 µm
SMA
80
70
60
50
40
S(Cu)(cm²)
30
20
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Doc ID 17935 Rev 1
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Package information
STPS1H100-Y
2
Package information
●
●
Epoxy meets UL94, V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
®
ECOPACK is an ST trademark.
Figure 14. SMA package dimensions
Dimensions
Ref
Millimeters
Inches
Min. Max.
E1
Min.
Max.
D
A1
A2
b
1.90
0.05
1.25
0.15
2.25
4.80
3.95
0.75
2.45
0.20
1.65
0.40
2.90
5.35
4.60
1.50
0.075
0.002
0.049
0.006
0.089
0.189
0.156
0.030
0.094
0.008
0.065
0.016
0.114
0.211
0.181
0.059
E
c
A1
D
A2
C
E
L
b
E1
L
Figure 15. SMA footprint dimensions in millimeters (inches)
2.63
1.4
1.4
(0.055)
(0.055)
(0.103)
1.64
(0.064)
5.43
(0.214)
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STPS1H100-Y
Figure 16. SMB package dimensions
Package information
Dimensions
Ref
Millimeters
Inches
E1
Min.
Max.
Min.
Max.
D
A1
A2
b
1.90
0.05
1.95
0.15
3.30
5.10
4.05
0.75
2.45
0.20
2.20
0.40
3.95
5.60
4.60
1.50
0.075
0.002
0.077
0.006
0.130
0.201
0.159
0.030
0.096
0.008
0.087
0.016
0.156
0.220
0.181
0.059
E
c
A1
D
A2
C
E
L
b
E1
L
Figure 17. SMB footprint dimensions in millimeters (inches)
1.62
2.60
1.62
(0.064) (0.102) (0.064)
2.18
(0.086)
5.84
(0.300)
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Ordering information
STPS1H100-Y
3
Ordering information
Table 5.
Ordering information
Order code
Marking
Package
Weight Base qty
Delivery mode
STPS1H100AY
STPS1H100UY
S11Y
G11Y
SMA
SMB
0.068 g
0.107 g
5000
2500
Tape and reel
Tape and reel
4
Revision history
Table 6.
Date
03-Dec-2010
Document revision history
Revision
Changes
1
First issue.
8/9
Doc ID 17935 Rev 1
STPS1H100-Y
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