STPS1H100AFN [STMICROELECTRONICS]
Rectifier Diode;
ST 
STPS1H100
Datasheet
100 V, 1 A power Schottky rectifier
Features
•
•
•
•
•
•
Negligible switching losses
High junction temperature capability
Low leakage current
Good trade off between leakage current and forward voltage drop
Avalanche capability specified
ECOPACK2 halogen-free component
Description
Schottky rectifiers designed for high frequency miniature switched mode power
supplies such as adaptors and on board DC/DC converters.
Packaged in SMA, SMA Flat, SMA Flat Notch,or SMB, this diode is ideal for use in
lighting and telecom power applications.
Product status
STPS1H100
Product summary
Symbol
Value
1 A
I
F(AV)
V
100 V
175 °C
0.62 V
RRM
T
V
j(max.)
F(max.)
DS1228 - Rev 8 - October 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
STPS1H100
Characteristics
1
Characteristics
Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol Parameter
Value
100
10
Unit
V
V
Repetitive peak reverse voltage
Forward rms current
RRM
I
A
F(RMS)
T = 150 °C
L
SMA
I
T = 155 °C
Average forward current, δ = 0.5
SMB, SMA Flat
SMA Flat Notch
1
A
F(AV)
L
T = 160 °C
L
I
t = 10 ms sinusoidal
Surge non repetitive forward current
Repetitive peak avalanche power
Storage temperature range
50
108
A
FSM
p
P
t = 10 µs, T = 125 °C
W
°C
°C
ARM
p
j
T
-65 to +175
+175
stg
Maximum operating junction temperature(1)
T
j
1. (dP /dT ) < (1/R ) condition to avoid thermal runaway for a diode on its own heatsink.
th(j-a)
tot
j
Table 2. Thermal parameters
Symbol
Parameter
Max. value
Unit
SMA
30
25
20
R
th(j-l)
Junction to lead
SMB
°C/W
SMA Flat, SMA Flat Notch
Table 3. Static electrical characteristics
Test conditions
Symbol
Parameter
Min.
Typ.
0.2
Max.
4
Unit
µA
T = 25 °C
j
-
-
-
-
-
-
(1)
V
= V
RRM
I
Reverse leakage current
R
R
T = 125 °C
j
0.5
mA
T = 25 °C
j
0.77
0.62
0.86
0.70
I = 1 A
F
T = 125 °C
j
0.58
0.65
(2)
V
Forward voltage drop
V
F
T = 25 °C
j
I = 2 A
F
T = 125 °C
j
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: t = 380 µs, δ < 2%
p
To evaluate the conduction losses, use the following equation:
2
P = 0.54 x IF(AV) + 0.08 x IF (RMS)
DS1228 - Rev 8
page 2/15
STPS1H100
Characteristics (curves)
1.1
Characteristics (curves)
Figure 1. Average forward power dissipation versus
average forward current
Figure 2. Average forward current versus ambient
temperature (δ = 0.5)
I
(A)
F(AV)
1.2
1.0
0.8
0.6
0.4
0.2
0.0
P
F(AV)
(W)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
Rth(j-a)=Rth(j-l)
δ
δ
= 0.5
= 0.2
δ
= 0.1
δ
= 0.05
R
th(j-a)=120°C/W
SMB / SMA Flat
SMA
Rth(j-a)=100°C/W
= 1
δ
Rth(j-a)=200°C/W
T
T
I
(A)
F(AV)
0.6
tp
=tp/T
1.0
δ
T
amb
(°C)
tp
=tp/T
δ
0.0
0.1
0.2
0.3
0.4
0.5
0.7
0.8
0.9
1.1
1.2
0
25
50
75
100
125
150
175
Figure 3. Normalized avalanche power derating versus
junction temperature (Tj = 125 °C)
Figure 4. Junction capacitance versus reverse voltage
applied (maximum values)
PARM(t
)
C(pF)
p
PARM(10 µs)
100
1
0.1
F=1 MHz
V
OSC=30 mVRMS
Tj=25 °C
0.01
0.001
tp(µs)
V (V)
R
10
1
10
100
1000
1
1 0
100
Figure 5. Relative variation of thermal impedance junction Figure 6. Relative variation of thermal impedance junction
to ambient versus pulse duration
to ambient versus pulse duration
Z
/R
Z
/R
th(j-a) th(j-a)
th(j-a) th(j-a)
1.00
0.10
0.01
1.00
0.10
0.01
SMA
SMB
Single pulse
Single pulse
t (s)
p
t (s)
p
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
DS1228 - Rev 8
page 3/15
STPS1H100
Characteristics (curves)
Figure 7. Relative variation of thermal impedance junction Figure 8. Reverse leakage current versus reverse voltage
to ambient versus pulse duration
applied (typical values)
Z
/R
I (µA)
th(j-a) th(j-a)
R
1.E+03
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
1.E-03
1.00
0.10
0.01
SMA Flat
SMA Flat Notch
Tj=125 °C
Single pulse
Tj=25 °C
t (s)
p
V (V)
R
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
0
10
20
30
40
50
60
70
80
90
100
Figure 9. Forward voltage drop versus forward current
(maximum values)
Figure 10. Thermal resistance junction to ambient versus
copper surface under each lead (SMB)
I
(A)
FM
R
th(j-a)
(°C/W)
100.00
10.00
1.00
200
150
100
50
Epoxy p rinted circuit board FR4, copper t hickness: 35 µm
SMB
Tj=125 °C
Tj=25 °C
0.10
S(Cu)(cm²)
VFM(V)
0.01
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Figure 11. Thermal resistance junction to ambient versus Figure 12. Thermal resistance junction to ambient versus
copper surface under each lead copper surface under each lead
R
th(j-a)
(°C/W)
R
th(j-a)
(°C/W)
200
150
100
50
200
150
100
50
Epoxy printed circuit board FR4,copper thickness: 35 µm
Epoxy printed circuit board FR4,copper thickness: 35 µm
SMA
SMA Flat
SMA Flat Notch
S(Cu)(cm²)
S(Cu)(cm²)
0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
DS1228 - Rev 8
page 4/15
STPS1H100
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1
SMB package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 13. SMB package outline
E1
D
E
A1
C
A2
L
b
DS1228 - Rev 8
page 5/15
STPS1H100
SMB package information
Table 4. SMB package mechanical data
Dimensions
Ref.
Millimeters
Inches (for reference only)
Min.
1.90
0.05
1.95
0.15
3.30
5.10
4.05
0.75
Max.
Min.
Max.
A1
A2
b
2.45
0.20
2.20
0.40
3.95
5.60
4.60
1.50
0.0748
0.0020
0.0768
0.0059
0.1299
0.2008
0.1594
0.0295
0.0965
0.0079
0.0867
0.0157
0.1556
0.2205
0.1811
0.0591
c
D
E
E1
L
Figure 14. SMB recommended footprint
2.60
1.62
1.62
(0.064)
(0.064)
(0.102)
2.18
(0.086)
5.84
(0.230)
DS1228 - Rev 8
page 6/15
STPS1H100
SMA package information
2.2
SMA package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 15. SMA package outline
E1
D
E
A1
A2
C
L
b
Table 5. SMA package mechanical data
Dimensions
Millimeters
Ref.
Inches
Min.
1.90
0.05
1.25
0.15
2.25
4.80
3.95
0.75
Max.
2.45
0.20
1.65
0.40
2.90
5.35
4.60
1.50
Min.
Max.
0.097
0.008
0.065
0.016
0.114
0.211
0.181
0.059
A1
A2
b
0.075
0.002
0.049
0.006
0.089
0.189
0.156
0.030
c
D
E
E1
L
DS1228 - Rev 8
page 7/15
STPS1H100
SMA package information
Figure 16. SMA recommended footprint in mm (inches)
2.63
1.4
1.4
(0.055)
(0.055)
(0.103)
1.64
(0.064)
5.43
(0.214)
DS1228 - Rev 8
page 8/15
STPS1H100
SMA Flat package information
2.3
SMA Flat package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 17. SMA Flat package outline
A
c
D
L 2x
L1 2x
E
E1
L
L2 2x
2x
b
Table 6. SMA Flat package mechanical data
Dimensions
Ref.
Millimeters
Inches (for reference only)
Min.
0.90
1.25
0.15
2.25
4.80
3.95
0.75
Typ.
Max.
1.10
1.65
0.40
2.95
5.60
4.60
1.50
Min.
0.035
0.049
0.005
0.088
0.188
0.155
0.029
Typ.
Max.
0.044
0.065
0.016
0.117
0.221
0.182
0.060
A
b
c
D
E
E1
L
L1
L2
0.50
0.50
0.020
0.020
DS1228 - Rev 8
page 9/15
STPS1H100
SMA Flat package information
Figure 18. SMA Flat recommended footprint in mm (inches)
5.52
(0.217)
1.52
(0.060)
1.20
3.12
1.20
(0.047)
(0.123)
(0.047)
millimeter
(inches)
s
DS1228 - Rev 8
page 10/15
STPS1H100
SMA Flat Notch package information
2.4
SMA Flat Notch package information
•
•
•
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Band indicates cathode
Figure 19. SMA Flat Notch package outline
Table 7. SMA Flat Notch package mechanical data
Dimensions
Ref.
Millimeters
Typ.
Inches (for reference only)
Min.
Max.
Min.
Typ.
Max.
A1
A1
b
0.90
1.10
0.035
0.044
0.05
0.002
1.25
0.15
2.25
5.00
3.95
1.65
0.40
2.90
5.35
4.60
0.049
0.005
0.088
0.196
0.155
0.065
0.016
0.115
0.211
0.182
C
D
E
E1
G
2.00
0.85
0.079
0.033
G1
L
0.75
1.20
0.029
L1
L2
L3
V
0.45
0.45
0.05
0.018
0.018
0.002
8°
8°
8°
8°
V1
DS1228 - Rev 8
page 11/15
STPS1H100
SMA Flat Notch package information
Figure 20. SMA Flat Notch recommended footprint in mm (inches)
3.12
1.20
1.20
(0.047)
(0.047)
(0.123)
1.52
(0.060)
5.52
(0.217)
DS1228 - Rev 8
page 12/15
STPS1H100
Ordering Information
3
Ordering Information
Table 8. Ordering information
Order code
STPS1H100A
STPS1H100U
STPS1H100AF
STPS1H100AFN
Marking
S11
Package
SMA
Weight
0.068 g
0.107 g
0.035 g
0.039 g
Base qty.
5000
Delivery mode
Tape and reel
Tape and reel
Tape and reel
Tape and reel
G11
SMB
2500
F11
SMA Flat
SMA Flat Notch
10 000
10 000
A11
DS1228 - Rev 8
page 13/15
STPS1H100
Revision history
Table 9. Document revision history
Changes
Date
Version
Jul-2003
4A
Last update.
SMA package dimensions update. Reference A1 max changed from 2.70 mm (0.106 inc.) to 2.03 mm
(0.080 inc).
Aug-2004
5
6
18-Sep-2008
Reformatted to current standards. Added SMAflat package.
Updated Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified),
Figure 3. Normalized avalanche power derating versus junction temperature (T = 125 °C). Removed
"Normalized avalanche power derating versus junction temperature".
06-Apr-2018
08-Oct-2019
7
8
j
Added Section 2.4 SMA Flat Notch package information.
DS1228 - Rev 8
page 14/15
STPS1H100
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DS1228 - Rev 8
page 15/15
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